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3D sequential integration closer to commercialisation thanks to CEA-Leti

Leti, a research institute at CEA Tech, has made a breakthrough in six 3D-sequential-integration process, making it more reliable, better performing, easier to manufacture and cheaper. CoolCube, CEA-Leti’s 3D monolithic or 3D sequential CMOS technology allows several layers of devices to be vertically stacked with unique connecting-via density above tens-of-million/mm2. The technology, part of the …

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